Purpose-Built for Quantum Technology

We develop precision VCSEL solutions for atomic clocks, quantum technology,

and advanced photonic systems for research, industrial, and emerging quantum applications.

VCSEL Packages

—— Non-magnetic VCSEL packages

For quantum sensing and atomic magnetometers, package material is not only a mechanical choice. It affects magnetic background, thermal behavior and signal stability.

For atomic sensing, quantum sensing, and other magnetically sensitive applications, magnetic materials located close to the sensing region may influence system performance. Ace Photonics provides non-magnetic VCSEL package configurations designed to reduce the use of magnetic materials around the laser source and support integration into precision optical systems.

Package materials, pin configuration, thermal management, optical windows, and mechanical structure can be customized according to the magnetic, optical, electrical, and environmental requirements of the customer's system.

Atomic Magnetometers and Quantum Sensing: Atomic magnetometers and other quantum sensing systems can be sensitive to magnetic materials and electrical currents located near the sensing region. Non-magnetic VCSEL packaging can help reduce magnetic disturbance associated with conventional package materials and provides greater flexibility when integrating the laser source close to an atomic vapor cell or sensing assembly.
Precision Measurement Systems: For atomic clocks, optical sensing systems, and other precision instruments, non-magnetic package configurations can be used where magnetic cleanliness is an important system-level consideration. Package structure, materials, thermal control, and operating conditions should be selected according to the requirements of the complete measurement system.
Customized Non-Magnetic Packaging: Ace Photonics can support customized non-magnetic VCSEL packaging with different wavelengths, package structures, optical windows, electrical interfaces, and thermal management options. Final package selection should be based on the customer's required wavelength, optical power, magnetic environment, operating temperature, mechanical constraints, and integration method.

VCSEL Packages - TO

VCSEL packages refer to the encapsulation or packaging of Vertical-Cavity Surface-Emitting Lasers (VCSELs) to protect them and facilitate integration into various systems and applications. These packages are designed to provide mechanical support, thermal management, and sometimes optical alignment for the VCSEL chip.

Common VCSEL packages include:

TO-Can (Transistor Outline Can)
Ceramic Packages
Butterfly Packages
Surface-Mount Packages
Custom Package

Non-magnetic VCSEL package lineup with multiple wavelengths

VCSEL Packages - SMD

A VCSEL SMD (Vertical-Cavity Surface-Emitting Laser Surface-Mount Device) refers to a combination of VCSEL technology and surface-mount packaging. The VCSEL is a type of laser diode that emits light perpendicular to the surface of the semiconductor chip, while the SMD refers to a method of mounting electronic components directly onto the surface of a printed circuit board (PCB) rather than through-hole mounting.

Advantage：

Compact Size and High Efficiency: The integration of VCSELs into SMD packages results in compact, energy-efficient devices that are well-suited for high-volume manufacturing.

Ease of Integration: SMD packaging simplifies the integration process into various electronic systems, enhancing manufacturability.
Thermal Management: VCSEL SMDs often feature efficient thermal dissipation, essential for maintaining performance and reliability under continuous operation.
Cost-Effectiveness: This packaging method is suitable for mass production, reducing costs.

TO-can vs SMD vs Non-Magnetic vs Custom Package

Package Type	Best For	Main Advantages	Key Considerations
TO-can Package	Laboratory systems, optical testing, sensing modules, and early-stage prototypes	Mature structure, good mechanical protection, easy handling, and suitable for optical alignment	Larger than SMD packages and may not be ideal for highly compact systems
SMD Package	Compact devices, 3D sensing, wearable sensors, consumer electronics, and volume production	Small footprint, suitable for automated assembly, and easier integration into PCB-based systems	Thermal design, reflow process, and optical alignment should be considered early
Non-Magnetic Package	Atomic magnetometers, quantum sensors, atomic clocks, and magnetically sensitive optical systems	Helps reduce magnetic interference and supports stable performance in precision measurement environments	Material selection, package structure, and system-level magnetic requirements must be confirmed
Custom Package	OEM systems, special optical layouts, harsh environments, and application-specific photonic modules	Flexible design for wavelength, power, window, lens, TEC, sensor, pinout, housing, or module integration	Requires clear project requirements, engineering review, and sample validation before production

About Ace Photonics

The vertical emission characteristics of VCSELs allow us to take advantage of surface mount packages developed specifically for LEDs and integrated circuits. Ace Photonics has expertise in manufacturing VCSELs packaged in Plastic Leaded Chip Carriers (PLCC) modules.

Ace Photonics has expertise in manufacturing VCSEL packaged in TO can or Plastic Leaded Chip Carriers (PLCC) modules.

Need a non-magnetic VCSEL package? Send your wavelength, power and package requirements.

Choose us

VCSEL epitaxial structures and device designs can be customized according to wavelength, optical power, spectral performance and application requirements.

Custom VCSEL Design

Semiconductor Processing Capability

Our device fabrication capabilities include ICP etching, wet oxidation, BCB processing and other VCSEL manufacturing processes.

Packaging and Application Support

We support bare die, TO, SMD, non-magnetic and customized packaging configurations for research, industrial and OEM applications.