Purpose-Built for Quantum technology

We develop precision VCSEL solutions for atomic clocks, quantum technology,

and advanced photonic systems for research, industrial, and emerging quantum applications.

VCSEL Packages

—— Non-magnetic VCSEL packages

For quantum sensing and atomic magnetometers, package material is not only a mechanical choice. It affects magnetic background, thermal behavior and signal stability.

Non-magnetic packaging can prevent the interference caused by magnetic materials in sensing, precision measurements, and certain specialized applications (such as measurements in MRI environments), thereby enhancing the device’s stability, reliability, and signal accuracy.

Atomic magnetometer (SERF): Traditional TO-46 packages contain magnetic components, which will affect ultra-high sensitivity atomic magnetometers. Using our VCSEL non-magnetic package can ensure that there is no magnetism, the detection distance can be reduced to a few millimeters, and the residual magnetic field generated by the drive and temperature control current can be ignored.
MRI compatible light source: In medical imaging systems, non-magnetic packaging can avoid interference with magnetic resonance imaging signals, improve imaging quality and equipment compatibility.
Quantum sensing and precision measurement: Quantum gyroscopes, atomic clocks and other devices that are extremely sensitive to magnetic fields require laser sources with zero magnetic packaging to ensure the purity of the measurement benchmark.

VCSEL Packages - TO

VCSEL packages refer to the encapsulation or packaging of Vertical-Cavity Surface-Emitting Lasers (VCSELs) to protect them and facilitate integration into various systems and applications. These packages are designed to provide mechanical support, thermal management, and sometimes optical alignment for the VCSEL chip.

Common VCSEL packages include:

TO-Can (Transistor Outline Can)
Ceramic Packages
Butterfly Packages
Surface-Mount Packages
Custom Package

Non-magnetic VCSEL package lineup with multiple wavelengths

VCSEL Packages - SMD

A VCSEL SMD (Vertical-Cavity Surface-Emitting Laser Surface-Mount Device) refers to a combination of VCSEL technology and surface-mount packaging. The VCSEL is a type of laser diode that emits light perpendicular to the surface of the semiconductor chip, while the SMD refers to a method of mounting electronic components directly onto the surface of a printed circuit board (PCB) rather than through-hole mounting.

Advantage：

Compact Size and High Efficiency: The integration of VCSELs into SMD packages results in compact, energy-efficient devices that are well-suited for high-volume manufacturing.

Ease of Integration: SMD packaging simplifies the integration process into various electronic systems, enhancing manufacturability.
Thermal Management: VCSEL SMDs often feature efficient thermal dissipation, essential for maintaining performance and reliability under continuous operation.
Cost-Effectiveness: This packaging method is suitable for mass production, reducing costs.

TO-can vs SMD vs Non-Magnetic vs Custom Package

Package Type	Best For	Main Advantages	Key Considerations
TO-can Package	Laboratory systems, optical testing, sensing modules, and early-stage prototypes	Mature structure, good mechanical protection, easy handling, and suitable for optical alignment	Larger than SMD packages and may not be ideal for highly compact systems
SMD Package	Compact devices, 3D sensing, wearable sensors, consumer electronics, and volume production	Small footprint, suitable for automated assembly, and easier integration into PCB-based systems	Thermal design, reflow process, and optical alignment should be considered early
Non-Magnetic Package	Atomic magnetometers, quantum sensors, atomic clocks, and magnetically sensitive optical systems	Helps reduce magnetic interference and supports stable performance in precision measurement environments	Material selection, package structure, and system-level magnetic requirements must be confirmed
Custom Package	OEM systems, special optical layouts, harsh environments, and application-specific photonic modules	Flexible design for wavelength, power, window, lens, TEC, sensor, pinout, housing, or module integration	Requires clear project requirements, engineering review, and sample validation before production

About Ace Photonics

The vertical emission characteristics of VCSELs allow us to take advantage of surface mount packages developed specifically for LEDs and integrated circuits. Ace Photonics has expertise in manufacturing VCSELs packaged in Plastic Leaded Chip Carriers (PLCC) modules.

Ace Photonics has expertise in manufacturing VCSEL packaged in TO can or Plastic Leaded Chip Carriers (PLCC) modules.

Need a non-magnetic VCSEL package? Send your wavelength, power and package requirements.

Choose us

ACE PHOTONICS

We have rich technical accumulation in the research and development of GaAs-based VCSEL lasers and can customize the epitaxial and device structure designs according to customer application requirements.

Advantage 1

Advantage 2

We have rich experience in semiconductor laser chip processing, such as inductively coupled plasma etching（ICP）, wet oxidation, and BCB processes.

Advantage 3

Relying on our experience in many aspects and relevant test conditions, we can develop customized products according to applications in special environments.